Section VI
TM 11-6625-2781-14&P-2
SECTION VI
REPLACEABLE PARTS
Table 6-1. Part Numbers for Assy Exchange Orders
6-1.
This section contains information relative to
ordering replacement parts and assemblies.
Exchange Assy
8553B
Assembly
Part Number
Part Number
6-2.
A3
Input Attenuator
08553-6021
08553-6078
when ordering printed circuit board assemblies on an
A5
Voltage Control
6007
6079
exchange basis.
A6
APC
6010
6076
6-3.
A7
VTO
6003
6072
A8
Reference Oscil.
60131
60134
designations and abbreviations used in the preparation of
A9
200 MHz IF
6004
6073
manuals by Hewlett-Packard.
A9A2
First Converter
6002
6071
6-4.
Table 6-4 provides code number identification of
A10
Second Converter
60132
60135
manufacturers.
6-5.
numbers, and other required ordering information.
Table 6-2. Reference Designators
REFERENCE DESIGNATORS
A
= assembly
F
= fuse
P
= plug
V
= vacuum tube,
B
= motor
FL
= Filter
Q
neon bulb.
BT
= battery
J
= jack
R
= resistor
photocell, etc.
C
= capacitor
K
= relay
RT
= thermistor
VR
= voltage
CP
= coupler
L
= inductor
S
= switch
regulator
CR
= diode
LS
= loud speaker
T
W
= cable
DL
= delay line
M
= meter
TB
= terminal board
X
= socket
DS
= device signaling (lamp)
MK
= microphone
TP
= test point
Y
= crystal
E
= misc electronic part
MP
= mechanical part
U
= integrated circuit
Z
= tuned cavity,
network
ABBREVIATIONS
A
= amperes
H
= henries
N/O
= normally open
RMO
= rack mount only
AFC
= automatic frequency
HDW
= hardware
NOM
= nominal
RMS
= root-mean square
control
HEX
= hexagonal
NPO
= negative positive
RWV
= reverse working
AMPL
= amplifier
HG
= mercury
zero (zero tem-
voltage
HR
= hour(s)
perature coef-
S-B
= slow-blow
BFO
= beat frequency oscila-
Hz
= Hertz
ficient)
SCR
= screw
tor
NPN
= negative-positive-
SE
= selenium
BE CU
= beryllium copper
IF
= intermediate freq
negative
SECT
= section(s)
BH
= binder head
IMPG
= impregnated
NRFR
= not recommended
SEMICON
= semiconductor
BP
= bandpass
INCD
= incandescent
for field re-
Sl
= silicon
BRS
= brass
INCL
= include(s)
placement
SIL
= silver
BWO
= backward wave oscilla-
INS
= insulation(ed)
NSR
= not separately
SL
= slide
tor
INT
= internal
replaceable
SPG
= spring
SPL
=special
CCW
= counterclockwise
OBD
= order by
SST
= Stainless steel
CER
= ceramic
K
= kilo = 1000
description
SR
= split ring
CMO
= cabinet mount only
OH
= oval head
STL
= steel
COEF
= coefficient
LH
= left hand
OX
= oxide
COM
= common
LIN
= linear taper
P
= peak
TA
= tantalum
COMP
LK WASH
= lock washer
PC
= printed circuit
TD
= time delay
-12
COMPL
= complete
LOG
= logarithmic taper
PF
= picofarads= 10
TGL
toggle
CQNN
= connector
LPF
= low pass filter
farads
THD
= thread
CP
= cadmium plate
PH BRZ
= phosphor bronze
TI
= titanium
CRT
= cathode-ray tube
Cw
= chodkwise
M
= milli 10-3
PHL
= Phillips
TOL
= tolerance
MEG
= meg =106
PIV
= peak inverse
TRIM
= trimmer
DEPC
= deposited carbon
MET FLM
= metal film
voltage
TWT
= traveling wave
DR
= drive
NMET OX
= metallic oxide
NPN
= positive-negative
tube
MFR
= manufacturer
positive
ELECT
= electrolytic
MHz
= mega Hertz
PlO
= part of
-6
ENCAP
= encapsulated
MINAT
= miniature
POLY
= polystrene
= micro = 10
EXT
= external
MOM
=momentary
PORC
= porcelain
MOS
= metalized
POS
= position(s)
VAR
= variable
F
= farads
substrate
POT
= potentiometer
VDCW
= dc working volts
FH
= flat head
MTG
= mounting
Ph
= peak-to-peak
FIL H
= Fillister head
MY
= "mylar"
PT
= point
FXD
=- fixed
MY
="mylar"
PWV
= peak working volt-
W/
= with
FxD
= fixed
age
W
= watts
-9
N
= nano (10 )
WIV
= working inverse
G
= giga (109)
N/C
= normally closed
RECT
voltage
GE
= germanium
NE
= neon
RF
= radio frequency
WW
= wirewound
GL
= glass
NI PL
= nickel plate
RH
= round head or
W/O
= without
GRD
= ground(ed)
right hand
6-1
